DocumentCode
1352429
Title
Thermocurable polymers as resists for imprint lithography
Author
Tormen, M. ; Borzenko, T. ; Schmidt, G. ; Liu, J. ; Molenkamp, L.W.
Author_Institution
Phys. Inst., Wurzburg Univ., Germany
Volume
36
Issue
11
fYear
2000
fDate
5/25/2000 12:00:00 AM
Firstpage
983
Lastpage
984
Abstract
In nanoimprint lithography, high pressures are utilised for embossing thermoplastics. This may introduce mechanical strain in the mould and the sample. By using a thermocurable polymer (polydimethylsiloxane, PDMS), a low pressure imprint process, working at pressures of <0.2 MPa, has proven viable. The new process may drastically reduce the thermal budget and the mechanical load in imprint lithography.
Keywords
polymer films; 0.2 MPa; PDMS; low pressure imprint process; nanoimprint lithography; polydimethylsiloxane; resist; thermocurable polymer;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20000708
Filename
849009
Link To Document