DocumentCode :
1352429
Title :
Thermocurable polymers as resists for imprint lithography
Author :
Tormen, M. ; Borzenko, T. ; Schmidt, G. ; Liu, J. ; Molenkamp, L.W.
Author_Institution :
Phys. Inst., Wurzburg Univ., Germany
Volume :
36
Issue :
11
fYear :
2000
fDate :
5/25/2000 12:00:00 AM
Firstpage :
983
Lastpage :
984
Abstract :
In nanoimprint lithography, high pressures are utilised for embossing thermoplastics. This may introduce mechanical strain in the mould and the sample. By using a thermocurable polymer (polydimethylsiloxane, PDMS), a low pressure imprint process, working at pressures of <0.2 MPa, has proven viable. The new process may drastically reduce the thermal budget and the mechanical load in imprint lithography.
Keywords :
polymer films; 0.2 MPa; PDMS; low pressure imprint process; nanoimprint lithography; polydimethylsiloxane; resist; thermocurable polymer;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:20000708
Filename :
849009
Link To Document :
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