DocumentCode :
1352928
Title :
A Reconfigurable Heterogeneous Multimedia Processor for IC-Stacking on Si-Interposer
Author :
Kim, Hyo-Eun ; Yoon, Jae-Sung ; Hwang, Kyu-Dong ; Kim, Young-Jun ; Park, Jun-Seok ; Kim, Lee-Sup
Author_Institution :
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Volume :
22
Issue :
4
fYear :
2012
fDate :
4/1/2012 12:00:00 AM
Firstpage :
589
Lastpage :
604
Abstract :
This paper presents a heterogeneous multimedia processor for embedded media applications such as image processing, vision, 3-D graphics and augmented reality (AR), assuming integrated circuit (IC)-stacking on Si-interposer. This processor embeds reconfigurable output drivers for external memory interface to increase memory bandwidth even in a mobile environment. The implemented output driver reconfigures its driving strength according to channel loss between the implemented processor and the memory, so it enables highspeed data communication while achieving 8× higher memory bandwidth compared to previous embedded media processors. The implemented processor includes three main programmable intellectual properties, mode-configurable vector processing units (MCVPUs), a unified filtering unit (UFU), and a unified shader. MCVPUs have 32 integer (16 bit) cores in order to support dual-mode operations between image-level processing and graphics processing. This mode-configuration enables a frame-level pipelining in AR application, so the proposed processor achieves 1.7× higher frame rate compared to the sequential AR processing. UFU supports 16 types of filtering operations only with a single instruction. Most image-level processing consists of various types of filtering operations, so UFU can improve media processing performance and energy-efficiency. UFU also supports texture filtering which is performance bottleneck of common graphics pipeline. A memory-access-efficient (off-chip memory) texturing algorithm named as an adaptive block selection is proposed to enhance texturing performance in 3-D graphics pipeline. UFU has two-level on-chip memory hierarchies, a 512B level-0 (L0) data buffer, and an 8kB level-1 (L1) static random-access memory (SRAM) cache. The small-sized L0 data buffer limits direct references to the large-sized L1 SRAM cache to reduce energy consumed in on-chip memories. Unified shader consists of four homogeneous scalar processing ele- ents (SPEs) for geometry operations in 3-D graphics. Each SPE has single-precision floating-point data-paths, since precision of geometry operations in 3-D graphics is important in today´s handheld devices (high resolution). The proposed media processor is fabricated in 0.13 μm CMOS technology with 4 mm × 4 mm chip size, and dissipates 275 mW for full AR operation.
Keywords :
CMOS integrated circuits; SRAM chips; cache storage; computer graphics; data communication; device drivers; embedded systems; graphics processing units; image processing; integrated circuits; mobile computing; multimedia computing; multiprocessing systems; pipeline processing; reconfigurable architectures; 3D graphics pipeline; AR application; CMOS technology; IC-stacking; MCVPU; SRAM cache; Si-interposer; UFU; adaptive block selection; channel loss; data buffer; dual-mode operations; embedded media applications; embedded media processors; energy-efficiency; external memory interface; floating-point data-paths; frame-level pipelining; graphics processing; handheld devices; high resolution; highspeed data communication; image-level processing; integrated circuit-stacking; main programmable intellectual properties; media processing performance; memory bandwidth; memory-access-efficient texturing algorithm; mobile environment; mode-configurable vector processing units; off-chip memory texturing algorithm; on-chip memories; output driver reconfigures; reconfigurable heterogeneous multimedia processor; reconfigurable output drivers; scalar processing elements; static random-access memory; texture filtering; two-level on-chip memory hierarchies; unified filtering unit; unified shader; Filtering; Graphics; Hardware; Media; Pipelines; Prototypes; Three dimensional displays; 3-D stacked IC; Si-interposer; augmented reality (AR); multimedia processor;
fLanguage :
English
Journal_Title :
Circuits and Systems for Video Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8215
Type :
jour
DOI :
10.1109/TCSVT.2011.2171209
Filename :
6051475
Link To Document :
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