DocumentCode :
1354082
Title :
Measurement of Electromechanical Property in Thick-Film EDDC-SmBCO Coated Conductors With High Critical Current
Author :
Hyung-Seop Shin ; Dedicatoria, M.J. ; Ho-Sup Kim
Author_Institution :
Dept. of Mech. Design Eng., Andong Nat. Univ., Andong, South Korea
Volume :
22
Issue :
1
fYear :
2012
Firstpage :
8400506
Lastpage :
8400506
Abstract :
In this paper, in order to ensure its performance in practical applications, the mechanical and electromechanical properties of thick-film evaporation-in-dual chamber (EDDC)-SmBCO coated conductor (CC) tapes with high critical current have been investigated. The effect of CC tape architecture and film thickness on critical current Ic in EDDC-SmBCO CC tapes with thick film under uniaxial tension and bending deformation was measured and compared with the Cu-stabilized sample. By adopting a bridge pattern and by applying a magnetic field and some measures, the electromechanical property of thick-film CC tapes with high Ic could be evaluated, suppressing the burnout during deformation. As a result, increasing the SmBCO film thickness affects the irreversible strain limit and Ic degradation behaviors. In the case of a 5- μm-thick film, an acceptable bending strain tolerance 0.34% was measured and the uniaxial irreversible strain limit of 0.28% can be still improved by an additional Cu stabilizer.
Keywords :
barium compounds; bending; critical currents; electromechanical effects; high-temperature superconductors; samarium compounds; superconducting tapes; SmBa2Cu3O7; bending deformation; bending strain; critical current; degradation properties; electromechanical properties; size 5 mum; thick-film evaporation-in-dual chamber coated conductor tapes; uniaxial irreversible strain limit; uniaxial tension; Copper; Current measurement; Degradation; Integrated circuits; Strain; Thickness measurement; Coated conductor (CC); SmBCO; critical current; electromechanical effects; thick film;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2011.2168392
Filename :
6054014
Link To Document :
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