DocumentCode :
1354423
Title :
Structure for improving the characteristics of high resistivity polycrystalline resistors [in CMOS]
Author :
Chen, Chung-Hui ; Fang, Yean-Kuen ; Wang, Ta-Wei ; Hsu, Yung-Lung ; Hsu, Shun-Liang
Author_Institution :
Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Volume :
36
Issue :
13
fYear :
2000
fDate :
6/22/2000 12:00:00 AM
Firstpage :
1155
Lastpage :
1156
Abstract :
A novel polysilicon resistor structure which employs a thin field oxide layer under the contact to sink the lateral arsenic dose, has been developed to improve the characteristics of conventional high resistivity phosphorus-doped polycrystalline silicon resistors. Improvements in the variation of sheet resistance with draw length, the voltage coefficient of resistance (VCR) and the temperature coefficient of resistance (TCR) have been confirmed by empirical data
Keywords :
CMOS integrated circuits; electric resistance; elemental semiconductors; resistors; semiconductor thin films; silicon; Si:P,As; draw length; high resistivity polycrystalline resistors; sheet resistance; temperature coefficient of resistance; thin field oxide layer; voltage coefficient of resistance;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:20000801
Filename :
850478
Link To Document :
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