Title :
Comparative Studies of Vibrational Reliability of Electroconductive Adhesive and Soldered Microjoints
Author :
Rawicz, Andrew H.
Author_Institution :
Faculty of Engineering Science; Simon Fraser University; Burnaby, British Columbia V5A 1S6 CANADA.
Abstract :
Electroconductive adhesive and soldered micro-joints have been tested for reliability under vibrational loads. Electroconductive adhesive microjoints exhibited higher resistance to vibrations. Accelerated reliability tests were based on a simple physical model which permits changes in the frequency of vibrations without changing the failure mode. The model is presented too.
Keywords :
Adhesives; Conductivity; Copper; Frequency; Joining materials; Silver; Surface acoustic waves; Surface resistance; Vibrations; Wire; Microjoint; Vibration;
Journal_Title :
Reliability, IEEE Transactions on
DOI :
10.1109/TR.1987.5222463
