DocumentCode :
1356307
Title :
Mechanical stress analysis of an LDD MOSFET structure
Author :
Ferreira, Paul ; Senez, Vincent ; Baccus, Burno
Author_Institution :
Dept. ISEN, IEMN, Villeneuve d´´Ascq, France
Volume :
43
Issue :
9
fYear :
1996
fDate :
9/1/1996 12:00:00 AM
Firstpage :
1525
Lastpage :
1532
Abstract :
This paper presents a mechanical stress study of the LDD MOSFET structure. The stresses are successively evaluated through the forming steps and topological modifications are proposed in order to minimize the residual substrate stress. The analysis is based on a two dimensional finite element method. It includes the cumulative effects from the thermal oxidation, the thermal cycles and the intrinsic stresses, allowing the estimation of the evolution of the stress field during the manufacturing. A nonlinear viscoelastic approach is used to model the nitride, thermal and deposited oxides rheological behaviors. For those oxides, a complete calibration of the mechanical properties is proposed
Keywords :
MOSFET; calibration; finite element analysis; mechanical properties; oxidation; rheology; semiconductor device models; stress analysis; thermal stresses; 2D finite element method; LDD MOSFET structure; deposited oxides; intrinsic stresses; mechanical properties; mechanical stress analysis; nonlinear viscoelastic approach; residual substrate stress; rheological behavior; thermal cycles; thermal oxidation; thermal oxides; topological modifications; two dimensional FEM; Calibration; Elasticity; Finite element methods; MOSFET circuits; Manufacturing; Oxidation; Residual stresses; Rheology; Thermal stresses; Viscosity;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.535345
Filename :
535345
Link To Document :
بازگشت