Mushroom-Type Ground Plane Structure for Wideband SSN Suppression in High-Speed Circuits

Author

Li, Jianjie ; Mao, Junfa ; Tang, Min

Author_Institution

Key Lab. of Minist. of Educ. of China for Res. of Design & Electromagn. Compatibility of High speed Electron. Syst., Shanghai Jiao Tong Univ., Shanghai, China

Volume

21

Issue

12

fYear

2011

Firstpage

646

Lastpage

648

Abstract

A novel design of ground plane with mushroom-type structures is proposed for wideband suppression of simultaneous switching noise (SSN) in high-speed printed circuit boards. The mushroom-type ground plane (MGP) structure consists of two square patches which are connected to the ground plane by specially designed traces and vias. It is more compact than the mushroom-type electromagnetic bandgap (MEBG) structure where the whole middle layer is occupied by periodic patches. Simulation and measurement results show that the SSN is suppressed significantly by the MGP. A -30 dB suppression bandwidth extending from 600 MHz to 7.5 GHz is achieved by a modified MGP structure.

Keywords

broadband networks; high-speed integrated circuits; interference suppression; photonic band gap; printed circuits; MGP structure; high-speed circuit; high-speed printed circuit board; mushroom-type electromagnetic bandgap structure; mushroom-type ground plane structure; simultaneous switching noise; two square patch; wideband SSN suppression; Cutoff frequency; Inductance; Noise measurement; Periodic structures; Resonant frequency; Wideband; Localized suppression; mushroom-type ground plane (MGP); simultaneous switching noise (SSN);

fLanguage

English

Journal_Title

Microwave and Wireless Components Letters, IEEE

Publisher

ieee

ISSN

1531-1309

Type

jour

DOI

10.1109/LMWC.2011.2170829

Filename

6056585