Title :
Design and operation of a fully integrated BiC/DMOS head-actuator PIC for computer hard-disk drives
Author :
Williams, Richard K. ; Chang, Allen ; Cornell, Michael E. ; Concklin, Barry
Author_Institution :
Siliconix Inc., Santa Clara, CA, USA
fDate :
7/1/1991 12:00:00 AM
Abstract :
A fully integrated head-actuator power integrated circuit (PIC) for computer hard-disk drives is described including a 1-A, 10-W CMOS H-bridge class-B amplifier. Operation of the complementary MOS-transistor power output stage includes a small-signal on-track mode and a five-interval high-speed large-signal seek mode. Analysis of a seek event reveals that maximum power dissipation occurs during the acceleration and deceleration intervals. Inductive flyback during break-before-make operation is clamped by integral multicollector bipolar transistors as confirmed by measurements and PISCES simulations. The mechanisms, occurrence, and device design considerations of the output transistor´s flyback current partitioning into type A (source) and type B (Nwell) collector and base (body) current components are analyzed. The concept and implementation of a synchronous clamp are introduced. Finally, performance and parasitic suppression considerations of an advanced self-isolated BiC/DMOS process and device arsenal are discussed
Keywords :
BIMOS integrated circuits; bridge circuits; electric actuators; hard discs; magnetic heads; position control; power integrated circuits; servomechanisms; BIMOS IC; CMOS; H-bridge; class-B amplifier; complementary MOS-transistor power output stage; computer hard-disk drives; flyback current partitioning; head positioning servo; head-actuator; high-speed large-signal seek mode; multicollector bipolar transistors; parasitic suppression; power integrated circuit; self-isolated BiC/DMOS process; small-signal on-track mode; synchronous clamp; Acceleration; Actuators; Drives; Hard disks; Magnetic heads; Packaging; Power amplifiers; Power dissipation; Power integrated circuits; Resistors;
Journal_Title :
Electron Devices, IEEE Transactions on