DocumentCode :
1357148
Title :
Patterning of Carbon Nanotubes by Material Assisted Laser Ablation Process
Author :
Chae, Junghun ; Jain, Kanti
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Volume :
9
Issue :
3
fYear :
2010
fDate :
5/1/2010 12:00:00 AM
Firstpage :
381
Lastpage :
385
Abstract :
Carbon nanotubes were patterned by a nonphotolithographic, low energy, large area, and high-throughput laser patterning process [material-assisted laser ablation (MALA)]. In this process, a residue layer was observed after the patterning process, requiring an additional cleaning process for the fabrication of electronic devices. In this paper, we investigated the mechanism of the residue layer formation, and optimized the MALA process so that no residue layer is formed after the patterning of carbon nanotubes. We demonstrated patterning of carbon nanotubes on 100 mm diameter silicon wafers, and the patterns of carbon nanotubes were sufficiently clean and sharp to be applicable in high-volume fabrication of electronic devices.
Keywords :
carbon nanotubes; elemental semiconductors; laser ablation; nanofabrication; nanopatterning; silicon; C; Si; carbon nanotubes; cleaning process; electronic devices; laser patterning process; material assisted laser ablation; nanofabrication; nanopatterning; nonphotolithography; residue layer; silicon wafers; size 100 mm; Carbon nanotube; excimer laser; material assisted laser ablation (MALA); photoablation;
fLanguage :
English
Journal_Title :
Nanotechnology, IEEE Transactions on
Publisher :
ieee
ISSN :
1536-125X
Type :
jour
DOI :
10.1109/TNANO.2009.2029696
Filename :
5223612
Link To Document :
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