DocumentCode
1358934
Title
Spatiotemporal Pattern Modeling for Fault Detection and Classification in Semiconductor Manufacturing
Author
Chang, Hyung Jin ; Song, Dong Sung ; Kim, Pyo Jae ; Choi, Jin Young
Author_Institution
Sch. of Electr. Eng. & Comput. Sci., ASRI Seoul Nat. Univ., Seoul, South Korea
Volume
25
Issue
1
fYear
2012
Firstpage
72
Lastpage
82
Abstract
This paper proposes a new approach to modeling the sequential flow characteristics of data patterns for detecting and classifying faulty processes in semiconductor manufacturing. Unlike conventional methods, which consider the spatial pattern distributions, the proposed approach models the spatial patterns local in time, transition time, staying time, and the sequential ordering of the local patterns through the process. To model these spatiotemporal patterns, we develop a sequential version of support vector data description (SVDD). This improves the precision of fault detection and easily detects the process start/end points; the moment a fault occurs can be captured immediately by checking the process start/end point based on the sequential order of SVDD. The detection of the moment a fault occurs is useful in analyzing the source of the fault.
Keywords
fault diagnosis; flow production systems; pattern classification; semiconductor device manufacture; spatiotemporal phenomena; support vector machines; SVDD; data patterns; fault classification; fault detection; faulty processes; semiconductor manufacturing; sequential flow characteristics; sequential ordering; sequential version; spatial pattern distributions; spatiotemporal pattern modeling; spatiotemporal patterns; support vector data description; Data models; Fault detection; Logic gates; Manufacturing; Principal component analysis; Support vector machines; Training; Fault detection; pattern recognition; sequential support vector data description; spatiotemporal pattern; start/end point detection;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2011.2172469
Filename
6058662
Link To Document