DocumentCode :
1358934
Title :
Spatiotemporal Pattern Modeling for Fault Detection and Classification in Semiconductor Manufacturing
Author :
Chang, Hyung Jin ; Song, Dong Sung ; Kim, Pyo Jae ; Choi, Jin Young
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., ASRI Seoul Nat. Univ., Seoul, South Korea
Volume :
25
Issue :
1
fYear :
2012
Firstpage :
72
Lastpage :
82
Abstract :
This paper proposes a new approach to modeling the sequential flow characteristics of data patterns for detecting and classifying faulty processes in semiconductor manufacturing. Unlike conventional methods, which consider the spatial pattern distributions, the proposed approach models the spatial patterns local in time, transition time, staying time, and the sequential ordering of the local patterns through the process. To model these spatiotemporal patterns, we develop a sequential version of support vector data description (SVDD). This improves the precision of fault detection and easily detects the process start/end points; the moment a fault occurs can be captured immediately by checking the process start/end point based on the sequential order of SVDD. The detection of the moment a fault occurs is useful in analyzing the source of the fault.
Keywords :
fault diagnosis; flow production systems; pattern classification; semiconductor device manufacture; spatiotemporal phenomena; support vector machines; SVDD; data patterns; fault classification; fault detection; faulty processes; semiconductor manufacturing; sequential flow characteristics; sequential ordering; sequential version; spatial pattern distributions; spatiotemporal pattern modeling; spatiotemporal patterns; support vector data description; Data models; Fault detection; Logic gates; Manufacturing; Principal component analysis; Support vector machines; Training; Fault detection; pattern recognition; sequential support vector data description; spatiotemporal pattern; start/end point detection;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2011.2172469
Filename :
6058662
Link To Document :
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