Abstract :
This book provides a concise knowledge base on modern packaging technology as envisioned by 45 authors, all recognized experts from academia and industry. All 19 chapters, taken together, paint a complete picture on packaging by systematically breaking it down into different subsets and addressing the material and processing challenges in each. Some of the topics covered include: the different types of bonding and soldering; ceramics and organic substrates; underfill technology; surface treatments; and material challenges and advances in emerging areas such as digital health and biomedical packaging, MEMS, high-power LEDS, and NEMs. This book is ideal for students and researchers, as well as for professionals in packaging technology, reliability, failure analysis, IC, MEMS, optical device product design, and their customers.
