Title :
Si-ULSI with a scaled down future
Author :
Vasudev, P.K. ; Zeitzoff, P.M.
Author_Institution :
SEMATECH, Austin, TX, USA
fDate :
3/1/1998 12:00:00 AM
Abstract :
Semiconductor technology in the 21st century will undergo major changes due to the significant material, engineering, and fundamental limits being approached as a consequence of scaling. Lithography is anticipated to undergo a radical change from optical to nonoptical. Device architecture and interconnects are also expected to undergo major changes in materials, structure, and fabrication technology
Keywords :
ULSI; elemental semiconductors; integrated circuit technology; lithography; silicon; technological forecasting; Si; ULSI; device architecture; fabrication technology; fundamental limits; interconnects; lithography; nonoptical techniques; scaling; semiconductor technology; Integrated circuit interconnections; Lithography; Microprocessors; Optical interconnections; Optical materials; Power dissipation; Power supplies; Semiconductor device packaging; Thermal management; X-rays;
Journal_Title :
Circuits and Devices Magazine, IEEE
