DocumentCode :
136147
Title :
Simulation of 3D FinFET doping profiles introduced by ion implantation and the impact on device performance
Author :
Liping Wang ; Brown, Andrew ; Cheng, Binjie ; Asenov, Asen
Author_Institution :
Sch. of Eng., Univ. of Glasgow, Glasgow, UK
fYear :
2014
fDate :
June 26 2014-July 4 2014
Firstpage :
1
Lastpage :
4
Abstract :
A simulation program, Anadope3D, developed to model ion implantations in FinFETs based on quasi-analytic methods, has been improved to include a set of analytical implantation models based on a Pearson distribution function, which is concise and computationally efficient. This C++ module has been integrated into the GSS atomistic device simulator GARAND, which enables more realistic doping distributions arising from ion implantation to be used for TCAD FinFET simulations. Simulations are performed on an example of an SOI FinFET with physical gate length of 20nm, including statistical simulations with Random Discrete Dopants (RDD). The impact of the realistic 3D doping profile on FinFET performance has been investigated.
Keywords :
MOSFET; ion implantation; semiconductor device models; semiconductor doping; silicon-on-insulator; statistical analysis; technology CAD (electronics); 3D FinFET doping; Anadope3D; C++ module; GARAND; GSS atomistic device simulator; Pearson distribution function; SOI; TCAD FinFET simulations; analytical implantation models; ion implantations; quasi-analytic methods; random discrete dopants; simulation program; size 20 nm; statistical simulations; Doping profiles; FinFETs; Ion implantation; Performance evaluation; Semiconductor process modeling; Three-dimensional displays; Doping; FinFETs; Ion implantation; Statistical variability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ion Implantation Technology (IIT), 2014 20th International Conference on
Conference_Location :
Portland, OR
Type :
conf
DOI :
10.1109/IIT.2014.6940008
Filename :
6940008
Link To Document :
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