DocumentCode :
136148
Title :
Atomic layer deposition of dopants for recoil implantation in finFET sidewalls
Author :
Seidel, Thomas E. ; Halls, Mathew D. ; Goldberg, Adina ; Elam, Jeffrey W. ; Mane, Anil ; Current, Michael I.
Author_Institution :
Seitek50, Palm Coast, FL, USA
fYear :
2014
fDate :
June 26 2014-July 4 2014
Firstpage :
1
Lastpage :
4
Abstract :
The doping of finFET sidewalls is studied using glancing angle, energetic ion beam recoil mixing of dopant-rich layers made by atomic layer deposited (ALD) films on vertical Si(100) surfaces. Density Function Theory (DTF) calculations show that surface conditions for initiating ALD with BF3 and PF3 dopants favor hydroxyl-Si surface termination. Monte Carlo calculations of the recoil-delivered-B highlights the process control advantages of grazing angle incidence energetic ion beams, as long as the deposited dopant layers are well controlled in thickness and composition, as one expects from ALD methods.
Keywords :
MOSFET; Monte Carlo methods; atomic layer deposition; boron compounds; density functional theory; ion beam mixing; ion implantation; phosphorus compounds; semiconductor doping; semiconductor thin films; ALD films; BF3; DTF calculations; FinFET sidewalls; Monte Carlo calculations; PF3; Si; atomic layer deposition; density function theory; dopant-rich layers; energetic ion beam recoil mixing; hydroxyl-silicon surface termination; of grazing angle incidence energetic ion beams; process control; recoil implantation; Atomic layer deposition; Doping; Films; FinFETs; Silicon; Substrates; Surface treatment; atomic layer deposition; finFET sidewall doping; ion recoil mixing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ion Implantation Technology (IIT), 2014 20th International Conference on
Conference_Location :
Portland, OR
Type :
conf
DOI :
10.1109/IIT.2014.6940009
Filename :
6940009
Link To Document :
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