DocumentCode :
136158
Title :
SuperScan™: Customized wafer dose patterning
Author :
Todorov, Stan S. ; Sawyer, John ; Gibilaro, Greg ; Hussey, Norm ; Gammel, George ; Olden, David ; Welsch, Marie ; Parisi, Nick
Author_Institution :
Varian Semicond. Equip., Appl. Mater., Gloucester, MA, USA
fYear :
2014
fDate :
June 26 2014-July 4 2014
Firstpage :
1
Lastpage :
4
Abstract :
Deliberately non-uniform dose implants are used in the industry to improve device performance across the wafer by compensating for non-uniformities introduced by process steps other than implantation. Varian ion implanters have offered this SuperScan™ capability for close to ten years [1-3]. Recent developments in SuperScan on Varian mid-current implanters significantly expand the ability to deliver virtually any desired dose pattern to wafer. This is accomplished by the introduction of new algorithms allowing custom dose delivery for any scan line and is enabled by the development of an enhanced dose controller and two-dimensional beam profiler. SuperScan 3 is capable of producing centered and off-center patterns without the need for wafer rotation with a zone dose ratio as high as 7:1 while maintaining excellent dose accuracy and uniformity within the different zones.
Keywords :
ion implantation; semiconductor device manufacture; semiconductor doping; SuperScan; centered patterns; customized wafer dose patterning; device performance; enhanced dose controller; nonuniform dose implants; off-center patterns; scan line; semiconductor device doping; two-dimensional beam profiler; varian ion implanters; varian mid-current implanters; wafer rotation; zone dose ratio; Accuracy; Graphical user interfaces; Implants; Ion implantation; Performance evaluation; Shape; Three-dimensional displays; ion implantation; semiconductor device doping; semiconductor manufacturing process control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ion Implantation Technology (IIT), 2014 20th International Conference on
Conference_Location :
Portland, OR
Type :
conf
DOI :
10.1109/IIT.2014.6940019
Filename :
6940019
Link To Document :
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