DocumentCode
136166
Title
High energy hydrogen and helium ion implanter
Author
Shengwu Chang ; Gori, Brian ; Norris, Curt ; Klein, John ; Decker-Lucke, Kurt
Author_Institution
Appl. Mater., Varian Semicond. Equip., Gloucester, MA, USA
fYear
2014
fDate
June 26 2014-July 4 2014
Firstpage
1
Lastpage
4
Abstract
High energy hydrogen and helium ion implants are required for enhancing performance of advanced power devices, such as improving breakdown voltage and switching response for IGBT products. The Varian Semiconductor Equipment business unit of Applied Materials has employed the VIISta platform architecture to provide production level throughputs of high energy hydrogen and helium for both standard and thin wafer substrates. Improvements to the implanter architecture will be described. The beam optics optimization, including the charge-exchange resonance and light species transport, will be discussed. The design and implementation of the radiation mitigation system, which meets industry standards for radiation limits and allows for operation in a typical production environment, will be described. Overall productivity and thin wafer implant capability are presented.
Keywords
insulated gate bipolar transistors; ion implantation; optimisation; power bipolar transistors; power field effect transistors; radiation hardening (electronics); Applied Materials VIISta platform architecture; IGBT product; Varian Semiconductor Equipment business unit; beam optics optimization; breakdown voltage; charge-exchange resonance; helium ion implanter; high energy hydrogen ion implanter; light species transport; power device; production level; radiation mitigation system; switching response; thin wafer implant capability; thin wafer substrate; Acceleration; Hydrogen; Ion beams; Production; Protons; H and He ion implanter; negative ion production; productivity; thin wafer;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology (IIT), 2014 20th International Conference on
Conference_Location
Portland, OR
Type
conf
DOI
10.1109/IIT.2014.6940027
Filename
6940027
Link To Document