DocumentCode :
1361665
Title :
A GSPN-Based Approach to Stacked Chips Scheduling Problem
Author :
Han, Yong-Hee ; Choi, Jin Young
Author_Institution :
Samsung Electron., Suwon, South Korea
Volume :
23
Issue :
1
fYear :
2010
Firstpage :
4
Lastpage :
12
Abstract :
This paper discusses scheduling characteristics unique in stacked chips [including multichip package (MCP) and multidie package (MDP)] production process such as reentrant work flow and synchronization constraint. It also proposes a modeling and analytical framework for stacked chips assembly operations, which is based on the formal framework of generalized stochastic Petri net. This approach allows the seamless integration of the logical and timed dynamics of stacked chip assembly operations in a single representation. Furthermore, the proposed framework supports the analytical representation of the stacked chips scheduling problem as a mathematical programming formulation, which can be effectively solved to optimality through enumerative techniques. The framework presentation and its capabilities are elucidated by detailed application on a small system configuration for MCP.
Keywords :
Petri nets; assembling; electronics packaging; mathematical programming; scheduling; GSPN based approach; analytical framework; generalized stochastic Petri net; logical dynamics; mathematical programming; multichip package; multidie package; reentrant work flow; scheduling characteristics; stacked chips assembly operation; stacked chips scheduling problem; synchronization constraint; timed dynamics; Capacitated reentrant line; generalized stochastic Petri net; multichip package; stacked chips; synchronization;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2009.2039251
Filename :
5357376
Link To Document :
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