DocumentCode :
1361847
Title :
Space-based high-temperature superconductivity experiment-design and performance
Author :
Polturak, E. ; Koren, G. ; Flohr, I. ; Waller, R. ; Guelman, M.
Author_Institution :
Dept. of Phys., Technion-Israel Inst. of Technol., Haifa, Israel
Volume :
48
Issue :
7
fYear :
2000
fDate :
7/1/2000 12:00:00 AM
Firstpage :
1289
Lastpage :
1291
Abstract :
In this paper, we describe the first successful superconductivity experiment in space. The experiment aims to test the long-term survivability of high-temperature superconductors (HTSs) under space conditions. Our system consists of a thin YBa2Cu3O 7 film integrated with a cryocooler. The experiment orbits the Earth aboard the TECHSAT II satellite as of July 1998. Periodic testing of the device returns data on its resistance, critical temperature, and critical current. As of now, the superconducting film has shown a marginal degradation of its properties. We hope to provide the basic long-term survivability data needed to advance applications of HTSs in space-based communication systems
Keywords :
barium compounds; copper compounds; critical currents; electric resistance; high-temperature superconductors; satellite communication; superconducting device reliability; superconducting thin films; superconducting transition temperature; yttrium compounds; Earth orbit; TECHSAT II satellite; YBCO film; YBa2Cu3O7; critical current; critical temperature; high-temperature superconductivity experiment; integrated cryocooler; long-term survivability data; periodic testing; properties degradation; resistance; space conditions; space-based HTSC experiment; space-based communication system applications; thin YBaCuO film; Critical current; Degradation; Earth; High temperature superconductors; Orbits; Satellite communication; Space technology; Superconducting films; Superconductivity; Testing;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/22.853476
Filename :
853476
Link To Document :
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