• DocumentCode
    136198
  • Title

    MeV-proton channeling in crystalline silicon

  • Author

    Jelinek, M. ; Schustereder, W. ; Laven, J.G. ; Schulze, H.-J. ; Kirnstoetter, S. ; Rommel, M. ; Frey, Lothar

  • Author_Institution
    Infineon Technol. Austria AG, Villach, Austria
  • fYear
    2014
  • fDate
    June 26 2014-July 4 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Hydrogen implantation has become an important application in the fabrication of power semiconductor devices. With the product requirement of a well-defined implantation profile, adequate control of the incident beam angle is necessary in order to avoid channeling effects. With respect to the different scan systems of commercial implanters and the crystal alignment of the bulk material the implant tilt and twist angles have to be adapted. We used commercially available <;100>-oriented silicon wafers to examine planar channeling along a {110}-plane for proton energies in the range of 0.5-2.5 MeV. The critical angle as a function of proton energy is determined from photothermal response measurements (TWIN).
  • Keywords
    channelling; elemental semiconductors; ion implantation; photothermal effects; power semiconductor devices; proton effects; silicon; MeV-proton channeling effect; Si; TWIN; bulk material; crystal alignment; crystalline silicon; electron volt energy 0.5 MeV to 2.5 MeV; hydrogen implantation; incident beam angle control; photothermal response measurement; planar channeling effect; power semiconductor device; proton energy; tilt implantation; twist angle; Crystals; Electrostatics; Implants; Laser beams; Protons; Silicon; channeling; crystalline silicon; proton implantation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology (IIT), 2014 20th International Conference on
  • Conference_Location
    Portland, OR
  • Type

    conf

  • DOI
    10.1109/IIT.2014.6940059
  • Filename
    6940059