• DocumentCode
    136222
  • Title

    Development of ETM microgrippers using Topology Optimization

  • Author

    Horstmann, Ruben ; Ardi, Liz K. R. ; Rehder, G.P. ; Silva, Emilio C. N. ; Carreno, Marcelo Nelson Paez

  • Author_Institution
    Lab. of Microelectron., Univ. of Sao Paulo, Sao Paulo, Brazil
  • fYear
    2014
  • fDate
    1-5 Sept. 2014
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    This article presents the development process of an microgripper for the manipulation of microelements such as particles of organic and inorganic materials. The device was deigned to manipulate microparticles between 130-140 micrometers in diameter using the thermal expansion due to the Joule effect. The microgripper geometry was optimized through a Topology Optimization Method, which applies a continuum topology optimization with spatial filtering technique. The optimized topology was modeled using Finite Element Method in order to verify the behavior of the designed geometry. The structure was fabricated using simple, low-cost process based on a flip-chip technology. The structure was fabricated using electroplated nickel, in order to increase the displacement of the tip of the microgripper. Finally, the electrothermomechanical microgripper was tested and the total displacement of the structure measured using optical microscopy. A total displacement of 20 microns can be safely achieved without permanent deformation of the structure.
  • Keywords
    Joule-Thomson effect; finite element analysis; flip-chip devices; geometry; grippers; micromanipulators; optimisation; thermal expansion; topology; ETM microgrippers; Joule effect; continuum topology optimization; electroplated nickel; electrothermomechanical microgripper; finite element method; flip-chip technology; microelement manipulation; microgripper geometry optimization; microparticle manipulation; optical microscopy; size 130 mum to 140 mum; spatial filtering technique; thermal expansion; Biological system modeling; Kinematics; Linear programming; Optimization; Sensitivity; Temperature sensors; Ultrasonic variables measurement; Micro-electro-mechanical systems; eletrothermomechanical microgripper; microgripper; topology optimization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics Technology and Devices (SBMicro), 2014 29th Symposium on
  • Conference_Location
    Aracaju
  • Type

    conf

  • DOI
    10.1109/SBMicro.2014.6940093
  • Filename
    6940093