• DocumentCode
    1362502
  • Title

    Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics Under Shock Loads

  • Author

    Lall, Pradeep ; Choudhary, Prakirti ; Gupte, Sameep ; Hofmeister, James

  • Author_Institution
    Dept. of Mech. Eng., Auburn Univ., Auburn, AL, USA
  • Volume
    32
  • Issue
    3
  • fYear
    2009
  • Firstpage
    600
  • Lastpage
    616
  • Abstract
    The built-in stress test (BIST) is extensively used for diagnostics or identification of failure. The current version of BIST approach is focused on reactive failure detection and provides limited insight into reliability and residual life. A new approach has been developed to monitor product-level damage during shock and vibration. The approach focuses on the pre- failure space and methodologies for quantification of failure in electronic equipment subject to shock and vibration loads using the dynamic response of the electronic equipment. The presented methodologies are applicable at the system level for the identification of impending failures to trigger repair or replacement significantly prior to failure. Leading indicators of shock-damage have been developed to correlate with the damage initiation and progression in shock and drop of electronic assemblies. Three methodologies have been investigated for feature extraction and health monitoring including development of a new solder- interconnect built-in reliability test, FFT-based statistical-pattern recognition, and time-frequency moments based statistical pattern recognition. The solder-joint built-in reliability test has been developed for detecting high resistance and intermittent faults in operational, fully programmed field programmable gate arrays. Frequency band energy is computed using FFT and utilized as the classification feature to check for damage and failure in the assembly. In addition, the time-frequency analysis has been used to study the energy densities of the signal in both time and frequency domains, and provide information about the time evolution of frequency content of transient- strain signal. Closed-form models and explicit finite-element models have been developed for the eigen frequencies, mode shapes, and transient response of electronic assemblies with various boundary conditions and component placement configurations. Model predictions have been validated with experimental data fr- om modal analysis. Pristine configurations have been perturbed to quantify the degradation in confidence values with progression of damage. Sensitivity of leading indicators of shock damage to subtle changes in boundary conditions,effective flexural rigidity, and transient strain response has been quantified.
  • Keywords
    bending strength; failure analysis; field programmable gate arrays; finite element analysis; reliability; solders; statistics; time-frequency analysis; built-in reliability test; built-in stress test; effective flexural rigidity; energy density; feature extraction; finite element models; frequency band energy; fully programmed field programmable gate arrays; health monitoring; intermittent faults; pristine configuration; shock damage; shock loads; solder-joint built-in reliability test; statistical pattern recognition; time-frequency analysis; time-frequency moments; transient strain response; Assembly; Built-in self-test; Condition monitoring; Electric shock; Electronic equipment; Electronic equipment testing; Feature extraction; Frequency; Lead; Pattern recognition; Failure analysis; finite element methods; health monitoring; reliability modeling; reliability testing; shock; vibration;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2009.2026426
  • Filename
    5230402