Title :
Solid state: The case for CMOS: Its low power consumption and many design choices mean that by the decade´s end, half of all ICs may be made by this technique
Author_Institution :
Texas Instruments Inc., Dallas, TX, USA
Abstract :
The versatility of CMOS in meeting diverse circuit-design requirements and the reduced cost of processing CMOS are examined from the viewpoint of very large-scale integration. The application of CMOS in dynamic memory is outlined, along with the tradeoffs in optimizing the processing of CMOS devices. The creation of faster CMOS circuits, improved layout density, and interconnections are also highlighted. The necessary advances expected to propel CMOS technology beyond the current level of circuits in the 4-Mb dynamic RAM and 1-b static RAM classes are examined, with particular regard to groove isolation, stacking of transistors, and silicon-on-insulator fabrication.
Keywords :
field effect integrated circuits; integrated memory circuits; large scale integration; CMOS; Si-insulator; VLSI; circuit-design; dynamic RAM; dynamic memory; field effect ICs; groove isolation; interconnections; layout density; stacking of transistors; static RAM; very large-scale integration; CMOS integrated circuits; CMOS technology; Logic gates; MOS devices; Metallization; Random access memory; Transistors;
Journal_Title :
Spectrum, IEEE
DOI :
10.1109/MSPEC.1983.6369986