Title :
Analysis of crosstalk and field coupling to lossy MTLs in a SPICE environment
Author :
Maio, Ivan ; Canavero, Flavio G. ; Dilecce, Bruno
Author_Institution :
Dipartimento di Elettronica, Politecnico di Torino, Italy
fDate :
8/1/1996 12:00:00 AM
Abstract :
This paper proposes a circuit model for lossy multiconductor transmission lines (MTLs) suitable for implementation in modern SPICE simulators, as well as in any simulator supporting differential operators. The model includes the effects of a uniform or nonuniform disturbing field illuminating the line and is especially devised for the transient simulation of electrically long wideband interconnects with frequency dependent per-unit-length parameters. The MTL is characterized by its transient matched scattering responses, which are computed including both dc and skin losses by means of a specific algorithm for the inversion of the Laplace transform. The line characteristics are then represented in terms of differential operators and ideal delays to improve the numerical efficiency and to simplify the coding of the model in existing simulators. The model can be successfully applied to many kinds of interconnects ranging from micrometric high-resistivity metallizations to low-loss PCBs and cables, and can be considered a practical extension of the widely appreciated lossless MTL SPICE model, which maintains the simplicity and efficiency
Keywords :
Laplace transforms; SPICE; circuit analysis computing; crosstalk; electromagnetic compatibility; electromagnetic wave scattering; integrated circuit interconnections; inverse problems; losses; transient analysis; transmission line theory; Laplace transform inversion; SPICE environment; SPICE simulators; cables; circuit model; coding; crosstalk; dc losses; delays; differential operators; disturbing field; electrically long wideband interconnects; field coupling; frequency dependent per-unit-length parameters; lossy MTL; lossy multiconductor transmission lines; low-loss PCB; micrometric high-resistivity metallizations; numerical efficiency; skin losses; transient matched scattering responses; transient simulation; Circuit simulation; Computational modeling; Coupling circuits; Crosstalk; Integrated circuit interconnections; Multiconductor transmission lines; Power system transients; Propagation losses; SPICE; Wideband;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on