• DocumentCode
    1363673
  • Title

    Analytical and Finite-Element Modeling of a Cross Kelvin Resistor Test Structure for Low Specific Contact Resistivity

  • Author

    Holland, Anthony S. ; Reeves, Geoffrey K. ; Bhaskaran, Madhu ; Sriram, Sharath

  • Author_Institution
    Microelectron. & Mater. Technol. Centre, R. Melbourne Inst. of Technol. Univ., Melbourne, VIC, Australia
  • Volume
    56
  • Issue
    10
  • fYear
    2009
  • Firstpage
    2250
  • Lastpage
    2254
  • Abstract
    Various test structures have been employed to determine the specific contact resistivity (rhoc) of ohmic contacts, and cross Kelvin resistor (CKR) test structures are most suitable for estimating low rhoc values. The value determined by CKRs includes error due to parasitic resistances that have been difficult to account for when rhoc is low (< 10-7 Omega ldr cm2). In this paper, an analytical technique for determining the error in measurements from CKR test structures is presented. The analytical model described for circular contacts is based on Bessel function expressions. Using several contacts of different diameter (d) with d/w les 0.4 (w is the width of the CKR arms), the parasitic resistance can be accurately accounted for by extrapolation of experimental data to d/w rarr 0. Finite-element modeling and experimental results for metal-to-silicide contacts are used to validate the analytical expressions presented.
  • Keywords
    contact resistance; finite element analysis; ohmic contacts; Bessel function expressions; cross Kelvin resistor test; finite-element modeling; low specific contact resistivity; ohmic contacts; Analytical models; Arm; Conductivity; Contact resistance; Electrical resistance measurement; Finite element methods; Kelvin; Ohmic contacts; Resistors; Testing; Contact resistance; cross Kelvin resistor (CKR); ohmic contacts; specific contact resistivity;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2009.2028623
  • Filename
    5232847