Title :
A Cavity Chip Interconnection Technology for Thick MEMS Chip Integration in MEMS-LSI Multichip Module
Author :
Lee, Kang-Wook ; Kanno, Soichiro ; Kiyoyama, Kouji ; Fukushima, Takafumi ; Tanaka, Tetsu ; Koyanagi, Mitsumasa
Author_Institution :
New Ind. Creation Hatchery Center, Tohoku Univ., Sendai, Japan
Abstract :
We develop a cavity chip interconnection technology for thick microelectromechanical systems (MEMS) chip integration. The cavity chip comprising Cu through-silicon via and Cu beam-lead wire was fabricated by micromachining processes. The cavity chip could easily connect a thick MEMS chip with a high step height of more than a few hundred micrometers without changing the circuit design of MEMS chip and complicated extra process. Fundamental characteristics are successfully obtained from a pressure-sensing MEMS chip of 360- thickness, where the MEMS chip was connected to a Si substrate by the cavity chip without degrading brittle sensing elements. This interconnection technology would provide a good solution for thick MEMS chip integration with high flexibility.
Keywords :
copper; integrated circuit design; integrated circuit interconnections; large scale integration; micromachining; micromechanical devices; pressure sensors; silicon; Cu; LSI multichip module; Si; beam-lead wire; cavity chip interconnection technology; circuit design; large-scale integration; microelectromechanical systems chip integration; micromachining processes; pressure-sensing MEMS chip; size 360 mum; thick MEMS chip integration; through-silicon via; Copper; Large scale integration; Multichip modules; Silicon; Through-silicon vias; Beam lead; cavity chip; heterogeneous integration; microelectromechanical systems (MEMS) large-scale integration (LSI) (MEMS-LSI) multichip module; sidewall interconnection; through-silicon via (TSV);
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2010.2082497
