• DocumentCode
    1364234
  • Title

    High-Q capacitors implemented in a CMOS process for low-power wireless applications

  • Author

    Hung, Chih-Ming ; Ho, Yo-Chuol ; Wu, I-Chang ; O, Kenneth

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
  • Volume
    46
  • Issue
    5
  • fYear
    1998
  • fDate
    5/1/1998 12:00:00 AM
  • Firstpage
    505
  • Lastpage
    511
  • Abstract
    In a foundry 0.8-μm CMOS process, low-cost capacitors with a measured Q factor of around 50 at 3 GHz and high intrinsic capacitance/area (~200 nF/cm2) were demonstrated. When extrapolated to 900 MHz, the Q factor is greater than 100. The capacitors use a poly-to-n-well MOS structure which has been commonly dismissed for high-Q applications due to the high n-well sheet resistance (~1 kΩ/□). Utilizing the structure, a low-noise amplifier (LNA) with a resonant frequency of 960 MHz, power gain of 16.2 dB, 1-dB compression point (P1 dB) of -5 dBm, and noise figure of 3.5 dB was demonstrated. Using a rule of thumb, the third-order harmonic intercept point (PIP3) was estimated to be 5 dBm from the P1 dB data. Despite concerns for nonlinearity of the capacitors, these results suggest that this capacitor structure could be used in LNA´s with a large dynamic range
  • Keywords
    CMOS integrated circuits; MOS capacitors; Q-factor; UHF amplifiers; UHF integrated circuits; integrated circuit noise; 0.8 micron; 3.5 dB; 900 MHz to 3 GHz; CMOS process; LNA; capacitor structure; compression point; dynamic range; high-Q capacitors; intrinsic capacitance/area; low-noise amplifier; low-power wireless applications; n-well sheet resistance; noise figure; poly-to-n-well MOS structure; power gain; third-order harmonic intercept point; Area measurement; CMOS process; Capacitance measurement; Foundries; Gain; Low-noise amplifiers; MOS capacitors; Q factor; Q measurement; Resonant frequency;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/22.668648
  • Filename
    668648