• DocumentCode
    1364363
  • Title

    Characteristics of trenched coplanar waveguide for high-resistivity Si MMIC applications

  • Author

    Yang, Suidong ; Hu, Zhirun ; Buchanan, Neil B. ; Fusco, Vincent F. ; Stewart, J. A Carson ; Wu, Yunhong ; Armstrong, B. Mervyn ; Armstrong, G.A. ; Gamble, Harold S.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Queen´´s Univ., Belfast, UK
  • Volume
    46
  • Issue
    5
  • fYear
    1998
  • fDate
    5/1/1998 12:00:00 AM
  • Firstpage
    623
  • Lastpage
    631
  • Abstract
    A novel low RF loss trenched coplanar waveguide (CPW) transmission-line structure fabricated using evaporated aluminum tracks on a high-resistivity (10-kΩ cm) silicon (HRS) substrate is reported. By assuming that Schottky contact boundaries exist at the metal silicon substrate interface in the CPW line, the finite-element analysis method is used to determine the simulated behavior of the structure. The distributed capacitance, leakage conduction current, and dynamic shunt conductance for the line are shown to be a function of dc bias applied to the line, and also to reduce as a function of trench depth in the normal bias regime. Experimental results show: (1) the reduction of RF losses in comparison with conventional aluminum conductor CPW line structures may be as much as 0.5 dB/cm at 30 GHz; (2) by proper positive dc biasing of a CPW line on a p-type HRS substrate, a further reduction (0.2 dB/cm) in RF loss at 30 GHz can be achieved; (3) predicted trends in line leakage current, capacitance, and relative characteristics impedance are experimentally verified. The proposed waveguide structure may be utilized in a special fabrication process designed for RF/microwave applications
  • Keywords
    MMIC; Schottky barriers; aluminium; capacitance; coplanar waveguides; elemental semiconductors; finite element analysis; leakage currents; losses; silicon; 30 GHz; Al-Si; Schottky contact boundaries; Si; capacitance; dc biasing; distributed capacitance; dynamic shunt conductance; fabrication process; finite-element analysis method; high-resistivity MMIC applications; leakage conduction current; line leakage current; low RF loss; normal bias regime; p-type HRS substrate; relative characteristics impedance; transmission-line structure; trench depth; trenched coplanar waveguide; waveguide structure; Aluminum; Analytical models; Capacitance; Coplanar waveguides; Finite element methods; Propagation losses; Radio frequency; Schottky barriers; Silicon; Transmission lines;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/22.668674
  • Filename
    668674