Title :
Limitations of Poole–Frenkel Conduction in Bilayer
MOS Devices
Author :
Southwick, Richard G., III ; Reed, Justin ; Buu, Christopher ; Butler, Ross ; Bersuker, Gennadi ; Knowlton, William B.
Author_Institution :
Dept. of Electr. & Comput. Eng., Boise State Univ., Boise, ID, USA
fDate :
6/1/2010 12:00:00 AM
Abstract :
The gate leakage current of metal-oxide-semiconductors (MOSs) composed of hafnium oxide (HfO2) exhibits temperature dependence, which is usually attributed to the standard Poole-Frenkel (P-F) transport model. However, the reported magnitudes of the trap barrier height vary significantly. This paper explores the fundamental challenges associated with applying the P-F model to describe transport in HfO2/ SiO2 bilayers in n/p MOS field-effect transistors composed of 3- and 5-nm HfO2 on 1.1-nm SiO2 dielectric stacks. The extracted P-F trap barrier height is shown to be dependent on several variables including the following: the temperature range, method of calculating the electric field, electric-field range considered, and HfO2 thickness. P-F conduction provides a consistent description of the gate leakage current only within a limited range of the current values while failing to explain the temperature dependence of the 3-nm HfO2 stacks for gate voltages of less than 1 V, leaving other possible temperature-dependent mechanisms to be explored.
Keywords :
MOSFET; Poole-Frenkel effect; cryogenics; hafnium compounds; high-k dielectric thin films; leakage currents; silicon compounds; HfO2-SiO2; P-F trap barrier height; Poole-Frenkel conduction transport model; bilayer HfO2-SiO2 MOS devices; cryogenic; dielectric stacks; electric field; gate leakage current; metal-oxide-semiconductors; n-p MOS field-effect transistors; size 1.1 nm; size 3 nm; size 5 nm; temperature dependence mechanism; Carrier transport; Poole–Frenkel (P–F); cryogenic; hafnium oxide $(hbox{HfO}_{2})$; high- $k$ dielectric; metal–oxide–semiconductors (MOS);
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2009.2039215