Title :
Experimental Approach and Evaluation on Dynamic Reliability of PBGA Assembly
Author :
Yang, Ping ; Chen, Zixia
Author_Institution :
Lab. of Adv. Design, Jiangsu Univ., Zhenjiang, China
Abstract :
The aim of this paper is to provide a systematic method to perform experimental test and theoretical evaluation on fatigue characteristics of plastic-ball-grid-array (PBGA) assembly under random vibration. A specified PBGA assembly which contains different structural and material parameters was manufactured. The fatigue characteristics of PBGA assembly under random vibration were tested. Manson-Coffin empirically derived formula and rain-flow algorithm were used to achieve the fatigue life of solder joints. In the meantime, the failure curve (reliability-cycle number curve) can be obtained by using Weibull distribution method when PBGA assembly is on different working situation. Finally, life prediction of corner solder balls was deduced based on three-band technology and cumulative damage index. Test results lay a basis for high-reliability design of PBGA assembly for engineering application.
Keywords :
ball grid arrays; failure analysis; fatigue; plastic packaging; reliability; soldering; vibrations; Manson-Coffin empirical formula; PBGA assembly; Weibull distribution method; corner solder ball; cumulative damage index; dynamic reliability; failure curve; fatigue characteristic; fatigue life; plastic ball grid array assembly; rain-flow algorithm; random vibration; reliability-cycle number curve; solder joints; Assembly systems; Fatigue; Laboratories; Manufacturing; Microelectronics; Packaging; Soldering; Stress; Testing; Vibrations; Cumulative damage index (CDI); fatigue life characteristics; plastic-ball-grid-array (PBGA) assembly; random vibration; reliability;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2009.2027974
