DocumentCode :
1365463
Title :
Electromagnetic Compatibility Benchmark-Modeling Approach for a Dual-Die CPU
Author :
Zhu, Boyuan ; Lu, Junwei ; Li, Erping
Author_Institution :
Sch. of Eng., Griffith Univ., Brisbane, QLD, Australia
Volume :
53
Issue :
1
fYear :
2011
Firstpage :
91
Lastpage :
98
Abstract :
The traditional challenging problem 2000-4 of electromagnetics (as indicated by the IEEE) proposed a benchmark model of a conventional CPU with a heatsink. However, after CPU entered the multiple-die century, the original model is no longer effective for the new generation multiple-die package. A novel model is proposed in this paper for electromagnet radiation modeling of the CPU with dual dies as a new electromagnetic compatibility benchmark-modeling approach. The modeling method is validated by the measurement, and the simulation and measurement results showed a good agreement, and demonstrated it is an effective modeling technique.
Keywords :
IEEE standards; electromagnetic compatibility; heat sinks; microprocessor chips; IEEE; dual die CPU; electromagnet radiation modeling; electromagnetic compatibility benchmark modeling; CPU with heatsink; dual die; electromagnetic compatibility (EMC); electromagnetic modeling;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2010.2053208
Filename :
5613929
Link To Document :
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