DocumentCode :
1365490
Title :
Direct Measurements of Self-Sputtering, Swelling, and Deposition Effects of N-Type Low-Energy Ion Implantations
Author :
Qin, Shu ; Zhuang, Kent ; Hu, Yongjun Jeff ; McTeer, Allen ; Lu, Shifeng
Author_Institution :
Micron Technol. Inc., Boise, ID, USA
Volume :
37
Issue :
10
fYear :
2009
Firstpage :
2082
Lastpage :
2089
Abstract :
Angle-resolved X-ray photoelectron spectroscopy method was used to study self-sputtering effects of different n-type low-energy doping techniques, including conventional monoatomic 75As and 31P beam-line ion implants and AsH3 plasma doping (PLAD). It has been found that the self-sputtering effects of the beam-line implants correlate with the mass of ion species. As beam-line implant shows more serious self-sputtering effect than monoatomic P and B beam-line implants. Very low energy P implants show surface-swelling phenomena. PLAD process using AsH3 gas species has no sputtering effects but has slight deposition under current process condition.
Keywords :
X-ray photoelectron spectra; arsenic; elemental semiconductors; ion implantation; phosphorus; plasma materials processing; semiconductor doping; silicon; sputtering; swelling; Si:As; Si:P; angle-resolved X-ray photoelectron spectroscopy; deposition effects; monoatomic beam-line ion implants; n-type low-energy doping; n-type low-energy ion implantations; plasma doping; self-sputtering effects; surface-swelling phenomena; Angle-Resolved X-ray Photoelectron Spectroscopy (ARXPS); deposition; plasma doping (PLAD); self-sputtering; surface swelling;
fLanguage :
English
Journal_Title :
Plasma Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0093-3813
Type :
jour
DOI :
10.1109/TPS.2009.2029111
Filename :
5233842
Link To Document :
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