Challenges and trends of high power IGBT module packaging

Insulated gate bipolar transistor (IGBT) modules play an important role in many power systems, in which the performance and reliability are limiting factors to system application. Therefore, intensive investigation has been done on the packaging as it affects IGBT module characteristics. In this paper, the status, challenges and trends of packaging technologies for high power traction and industrial drive IGBT modules are discussed. It is suggested that the advanced joining and interconnection technologies for the future power module assembly will improve the module performance and reliability significantly.