Title :
Solid state: In smarter design and fabrication of ICs, power and logic are mixed on the same chip and circuits are integrated over an entire wafer
Abstract :
Developments in microelectronics during 1984 are reviewed. These include: mixing power and logic on the same chip; progress in wafer-scale integration; new packages that improve on DIPs; and fast design turnaround springing from the availability of relatively inexpensive silicon compilers for commercial IC design.
Keywords :
CMOS integrated circuits; VLSI; circuit layout CAD; digital integrated circuits; field effect integrated circuits; insulated gate field effect transistors; 1984; commercial IC design; digital integrated circuits; dual-inline packages; fast design turnaround; field effect integrated circuits; microelectronics; power/logic mixing on same chip; silicon compilers; wafer-scale integration; CMOS integrated circuits; Companies; Integrated circuit interconnections; Logic gates; Pins; Standards; Very high speed integrated circuits;
Journal_Title :
Spectrum, IEEE
DOI :
10.1109/MSPEC.1985.6370530
