Title :
Simulation and design of lossy transmission lines in a thin-film multichip package
Author :
Nayak, Deepak ; Hwang, Lih-Tyng ; Turlik, Iwona
Author_Institution :
Microelectron. Center of North Carolina, Research Triangle Park, NC, USA
fDate :
6/1/1990 12:00:00 AM
Abstract :
A thin-film multichip package design was evaluated for its applications in packaging high-performance VLSI/ULSI chips. Typical thin-film interconnections (copper lines 8 μm wide and 4 μm thick) were analyzed, and a large CMOS driver was used in the simulation. It was found that a pitch of 32 μm for the microstrip configuration and 20 μm for the stripline configuration is required to obtain a low-crosstalk environment for an input frequency up to 1 GHz. It is shown that long lines (length between 8 cm and 18 cm) do not need any termination, but short lines (shorter than 8 cm, but longer than the length at which a line is considered to be a lumped circuit) must be terminated with customized termination resistors to obtain optimal package performance. The loading effects n the termination behavior of short and long thin-film microstrips are also discussed. It is shown that high power generation in thin-film lines at a high frequency (1 GHz) would require an advanced cooling technique for the thin-film multichip package
Keywords :
CMOS integrated circuits; VLSI; cooling; crosstalk; hybrid integrated circuits; metallisation; packaging; strip lines; thin film circuits; 1 GHz; 4 micron; 8 micron; 8 to 18 cm; CMOS driver; Cu lines; cooling; high performance ULSI chips packaging; input frequency; long lines; loss transmission line design; low-crosstalk environment; microstrip configuration; short lines; stripline configuration; termination behavior; thin-film interconnections; thin-film multichip package; thin-film multichip package design; Frequency; Microstrip; Packaging; Power transmission lines; Propagation losses; Thin film circuits; Transistors; Transmission lines; Ultra large scale integration; Very large scale integration;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
