Automatic defect classification of printed wiring board solder joints

Author

Driels, Morris R. ; Nolan, Daniel J.

Author_Institution

Dept. of Mech. Eng., US Naval Postgraduate Sch., Monterey, CA, USA

Volume

13

Issue

2

fYear

1990

fDate

6/1/1990 12:00:00 AM

Firstpage

331

Lastpage

340

Abstract

An automatic windowing algorithm is developed for use in automatic printed wiring board solder joint inspection. The method uses Hough curve detection to locate the solder joint within the image. Eleven good features selected by C.-C. Lee (1987) for use in the solder joint inspection task are studied in detail for purposes of optimizing the inspection process. This is done with the aid of a minimum distance classification algorithm that allows for classification of the solder joint based on user selected features. Automatic windowing, feature selection, and classification algorithms are compiled into a complete solder joint inspection system

Keywords

computerised pattern recognition; computerised picture processing; inspection; printed circuit manufacture; quality control; soldering; Hough curve detection; automatic optical inspection; automatic windowing algorithm; classification algorithms; feature extraction; feature selection; minimum distance classification algorithm; printed wiring board solder joints; solder joint inspection system; Circuit faults; Classification algorithms; Electronics industry; Inspection; Mechanical engineering; Printed circuits; Production; Shape measurement; Soldering; Wiring;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.56166

Filename

56166