Benzocyclobutene interlayer dielectrics for thin film multichip modules

Author

Johnson, R. Wayne ; Phillips, Timothy L. ; Weidner, William K. ; Hahn, Stephen F. ; Burdeaux, David C. ; Townsend, Paul H.

Author_Institution

Dept. of Electr. Eng., Auburn Univ., IL, USA

Volume

13

Issue

2

fYear

1990

fDate

6/1/1990 12:00:00 AM

Firstpage

347

Lastpage

352

Abstract

An organic dielectric derived from benzocyclobutene has been investigated as an interlayer dielectric for thin-film multichip modules. The material is processed using standard semiconductor techniques. Key attributes of the polymer are a low dielectric constant (2.7), low moisture absorption (0.2-0.3%), low processing temperature (250°C), good chemical resistance, and high thermal stability (approximately 350°C). The material provides an alternative to polyimide as a thin-film insulator

Keywords

dielectric thin films; hybrid integrated circuits; integrated circuit technology; materials testing; organic insulating materials; 250 C; 350 C; alternative to polyimide; benzocyclobutene; chemical resistance; interlayer dielectric; low dielectric constant; low moisture absorption; low permittivity; low processing temperature; organic dielectric; thermal stability; thin film multichip modules; thin-film insulator; Absorption; Dielectric constant; Dielectric materials; Dielectric thin films; Moisture; Multichip modules; Polymer films; Semiconductor materials; Semiconductor thin films; Thermal resistance;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.56168

Filename

56168