• DocumentCode
    1366203
  • Title

    A study of the off-contact screen printing process. II. Analysis of the model of the printing process

  • Author

    Owczarek, Jerzy A. ; Howland, Frank L.

  • Author_Institution
    Dept. of Mech. Eng. & Mech., Lehigh Univ., Bethlehem, PA, USA
  • Volume
    13
  • Issue
    2
  • fYear
    1990
  • fDate
    6/1/1990 12:00:00 AM
  • Firstpage
    368
  • Lastpage
    375
  • Abstract
    For pt.I see ibid., vol.13, no.2, p.358-67, 1990. The analysis presented is concerned with the derivation of equations which allows calculation of the thickness of dry paste deposited on a substrate in the off-contact screen printing process. The rheological properties of the paste are approximated by those of a power-law fluid. Deformed squeegee shape in the paste deposition region is considered to be that of a wedge. The equations show that the height of the deposited paste depends on the magnitude of the equivalent paste height under the squeegee and on the paste flow speed under the squeegee. The equivalent paste height under the squeegee depends, for a given screen, on the deformability of the squeegee and on the emulsion height. The paste flow speed under the squeegee depends, for a given paste and screen, on the magnitude of the pressure buildup ahead of the squeegee. The pressure buildup in turn is a function of the squeegee deformation characteristics and of squeegee translational speed
  • Keywords
    integrated circuit technology; printing; thick film circuits; deformability; dry paste; emulsion height; equivalent paste height; model; off-contact screen printing process; paste deposition region; paste flow speed; power-law fluid; pressure buildup; rheological properties; squeegee shape; squeegee translational speed; thickness; Blades; Coordinate measuring machines; Equations; Floods; Printing; Residual stresses; Rheology; Shape; Solids; Wire;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/33.56170
  • Filename
    56170