A model for moisture induced corrosion failures in microelectronic packages

Author

Pecht, Michael

Author_Institution

CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA

Volume

13

Issue

2

fYear

1990

fDate

6/1/1990 12:00:00 AM

Firstpage

383

Lastpage

389

Abstract

As integrated circuit geometries become smaller and package sizes and I/O counts increase, there is an increased potential of failures resulting from moisture ingress and corrosion. To aid in reliability prediction, design for reliability, and assessing reliability tradeoffs, a methodology for coupling the mechanisms of moisture ingress and corrosion in microelectronic packages into a first-order failure-rate model is presented. The model focuses on aluminum metallization corrosion resulting from chlorine-based contaminants, but is general enough to be applied to other cases

Keywords

corrosion testing; failure analysis; packaging; reliability; Al; I/O counts; chlorine-based contaminants; coupling; first-order failure-rate model; integrated circuit geometries; microelectronic packages; moisture induced corrosion failures; moisture ingress; package sizes; reliability; Aluminum; Computational geometry; Corrosion; Coupling circuits; Integrated circuit packaging; Integrated circuit reliability; Metallization; Microelectronics; Moisture; Predictive models;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.56172

Filename

56172