Title :
A model for moisture induced corrosion failures in microelectronic packages
Author_Institution :
CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
fDate :
6/1/1990 12:00:00 AM
Abstract :
As integrated circuit geometries become smaller and package sizes and I/O counts increase, there is an increased potential of failures resulting from moisture ingress and corrosion. To aid in reliability prediction, design for reliability, and assessing reliability tradeoffs, a methodology for coupling the mechanisms of moisture ingress and corrosion in microelectronic packages into a first-order failure-rate model is presented. The model focuses on aluminum metallization corrosion resulting from chlorine-based contaminants, but is general enough to be applied to other cases
Keywords :
corrosion testing; failure analysis; packaging; reliability; Al; I/O counts; chlorine-based contaminants; coupling; first-order failure-rate model; integrated circuit geometries; microelectronic packages; moisture induced corrosion failures; moisture ingress; package sizes; reliability; Aluminum; Computational geometry; Corrosion; Coupling circuits; Integrated circuit packaging; Integrated circuit reliability; Metallization; Microelectronics; Moisture; Predictive models;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
