• DocumentCode
    136649
  • Title

    A modified submodule voltage balancing method of modular multilevel converter

  • Author

    Xing Zhang ; Ping Wang

  • Author_Institution
    Key Lab. of Power Electronicsand Electr. Drive, Inst. of Electr. Eng., Beijing, China
  • fYear
    2014
  • fDate
    Aug. 31 2014-Sept. 3 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Modular multilevel converter (MMC) is the new generation multilevel converter, mainly intended for medium or high voltage power conversion. Because of the modular topology of MMC, it is significantly important to balance the submodule (SM) capacitor voltages for the converter´s safe operating. For the sake of reducing the switching frequency of the power semiconductors, this paper proposed a threshold value method. This method sets a threshold value, classifies the voltages into three groups and sorts a certain number of SMs with maximum and minimum voltages. Then corresponding SMs are turned on or off based on the arm current direction. This method can realize the balance of the SM capacitor voltages with reduced switching frequency of power semiconductors. Simulation results of a MMC-based three phase rectifier has verified the validity of this SM capacitor voltage balancing method.
  • Keywords
    power semiconductor devices; rectifiers; MMC-based three phase rectifier; SM capacitor voltages; arm current direction; high voltage power conversion; medium voltage power conversion; modified submodule voltage balancing method; modular multilevel converter; modular topology; power semiconductors; submodule capacitor voltages; switching frequency reduction; threshold value method; Capacitors; Rectifiers; Sorting; Switches; Switching frequency; Threshold voltage; Voltage control; modular multilevel converter(MMC); switching frequency; threshold value; voltage balancing method;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transportation Electrification Asia-Pacific (ITEC Asia-Pacific), 2014 IEEE Conference and Expo
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-4240-4
  • Type

    conf

  • DOI
    10.1109/ITEC-AP.2014.6940920
  • Filename
    6940920