DocumentCode
1366546
Title
Gutting chip-testing costs: Designing VLSI circuits for testability is the most efficient way to reduce the relative costs of assuring high chip reliability
Author
Seth, Sharad C. ; Agrawal, Vishwani D.
Author_Institution
Nebraska Univ., Lincoln, NE, USA
Volume
22
Issue
4
fYear
1985
fDate
4/1/1985 12:00:00 AM
Firstpage
38
Lastpage
45
Abstract
Testing now accounts for 10% of the total cost of manufacturing a 1-kb random-access-memory chip. For a 64K RAM chip, the figure rises to 40%. New techniques, however, promise to hold down costs by tackling the circuit-testing problem in the design stage. The new methods include computer programs that assess during design how easily a circuit can be tested, scan-design techniques for testing sequential circuitry, and ways of partitioning chips into blocks of manageable size for testing. Random testing and built-in self-testing are also employed in some cases to avoid exhaustive testing for every possible fault in a circuit. These new methods are described.
Keywords
integrated circuit testing; integrated memory circuits; logic testing; random-access storage; RAM chip; integrated circuit testing; integrated memory circuits; logic testing; random-access-memory chip; scan-design techniques; self-testing; sequential circuits; Circuit faults; Integrated circuit modeling; Logic gates; Pins; Semiconductor device measurement; Testing; Vectors;
fLanguage
English
Journal_Title
Spectrum, IEEE
Publisher
ieee
ISSN
0018-9235
Type
jour
DOI
10.1109/MSPEC.1985.6370618
Filename
6370618
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