Title :
First MCM-D modules for the b-physics layer of the ATLAS Pixel Detector
Author :
Basken, O. ; Becks, K.-H. ; Ehrmann, O. ; Gerlach, P. ; Grah, Ch. ; Gregor, I.M. ; Linder, Ch. ; Meuser, S. ; Richardson, J. ; Topper, M. ; Wolf, J.
Author_Institution :
ATLAS Pixel Collaboration, CERN, Geneva, Switzerland
fDate :
6/1/2000 12:00:00 AM
Abstract :
The innermost layer (b-physics layer) of the ATLAS Pixel Detector will consist of modules based on MCM-D technology. Such a module consists of a sensor tile with an active area of 16.4 mm/spl times/60.4 mm, 16 read out ICs, each serving 24/spl times/ 160 pixel unit cells, a module controller chip (MCC), an optical transceiver and the local signal interconnection and power distribution busses. We show a prototype of such a module with additional test pads on both sides. The outer dimensions of the final module will be 21.4 mm/spl times/67.8 mm. The extremely high wiring density, which is necessary to interconnect the read-out chips, was achieved using a thin film copper/photo-BCB process on the pixel array. The bumping of the read out chips was done using electroplating PbSn. All dice are then attached by flip-chip assembly to the sensor diodes and the local busses. The focus of this paper is the description of the first results of such MCM-D-type modules.
Keywords :
position sensitive particle detectors; semiconductor technology; silicon radiation detectors; ATLAS; MCM-D modules; PbSn; Pixel Detector; Si; b-physics layer; electroplating; flip-chip assembly; module controller chip; read out chips; Detectors; Optical control; Optical films; Optical interconnections; Optical sensors; Power distribution; Prototypes; Testing; Transceivers;
Journal_Title :
Nuclear Science, IEEE Transactions on