Title :
High density interconnect multi-chip module for the front-end electronics of the PHENIX/MVD
Author :
Hahn, S.F. ; Sullivan, J.P. ; van Hecke, H.W. ; Simon-Gillo, J.E. ; Smith, G.D. ; Schlei, B.R. ; Sun, A. ; Young, G.R. ; Britton, C.L. ; Emery, M.S. ; Bobrek, M.
Author_Institution :
Los Alamos Nat. Lab., NM, USA
fDate :
6/1/2000 12:00:00 AM
Abstract :
A multi-chip module (MCM) based on High Density Interconnect (HDI) technology was developed for the front-end electronics of a high energy nuclear physics experiment to process charge pulses from silicon detectors. Stringent requirements in performance as well as low radiation length and minimum physical size of the module dictated the use of the most sophisticated MCM technology available. The module handles 256 input channels on an alumina substrate with milled cavities for die placements and four layers of thin-film traces of 42u width. A total of 20 custom integrated circuit chips and 98 passive components are assembled on a substrate of size 43 mm×48 mm. Various aspects of development efforts for the design and fabrication as well as the electrical test results of the module are discussed
Keywords :
integrated circuit interconnections; multichip modules; nuclear electronics; silicon radiation detectors; PHENIX/MVD; Si; alumina substrate; charge pulses; custom integrated circuit chips; front-end electronics; high density interconnect multi-chip module; input channels; milled cavities; passive components; silicon detectors; Application specific integrated circuits; Assembly; Detectors; Integrated circuit interconnections; Integrated circuit technology; Nuclear electronics; Nuclear physics; Silicon; Substrates; Thin film circuits;
Journal_Title :
Nuclear Science, IEEE Transactions on
