• DocumentCode
    1366969
  • Title

    Impact of Forming, Welding, and Electropolishing on Pitting and the Surface Finish of SRF Cavity Niobium

  • Author

    Cooley, L.D. ; Burk, D. ; Cooper, C. ; Dhanaraj, N. ; Foley, M. ; Ford, D. ; Gould, K. ; Hicks, D. ; Novitski, R. ; Romanenko, A. ; Schuessler, R. ; Thompson, C. ; Wu, G.

  • Author_Institution
    SRF Mater. Group, Fermi Nat. Accel. Lab., Batavia, IL, USA
  • Volume
    21
  • Issue
    3
  • fYear
    2011
  • fDate
    6/1/2011 12:00:00 AM
  • Firstpage
    2609
  • Lastpage
    2614
  • Abstract
    A broad range of coupon electropolishing experiments are described to ascertain the mechanism(s) by which large defects are formed near superconducting radio-frequency (SRF) cavity welds. Cold-worked vs. annealed metal, the presence of a weld, and several variations of electropolishing (EP) parameters were considered. Pitting is strongly promoted by cold work and agitation of the EP solution. Welding also promotes pitting, but less so compared with the other factors above. Temperature increase during EP did not strongly affect glossiness or pitting, but the reduced viscosity made the electrolyte more susceptible to agitation. The experiments suggest that several factors that are rather benign alone are combined by the cavity forming, welding, and processing sequence to promote the formation of defects such as pits. Process changes to mitigate these risks are discussed.
  • Keywords
    electrolytic polishing; forming processes; linear colliders; niobium; superconducting cavity resonators; surface finishing; welding; Nb; SRF cavity; agitation; cold work; coupon electropolishing; forming; glossiness; niobium; pitting; superconducting radiofrequency cavity; surface finish; welding; Annealing; Cavity resonators; Etching; Materials; Niobium; Welding; Electropolishing; linear accelerator; linear collider; niobium; superconducting radio-frequency cavities;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2010.2083629
  • Filename
    5617301