DocumentCode :
1367041
Title :
DC and RF performance of 0.25 μm p-type SiGe MODFET
Author :
Arafa, M. ; Fay, P. ; Ismail, K. ; Chu, J.O. ; Meyerson, B.S. ; Adesida, I.
Author_Institution :
Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
Volume :
17
Issue :
9
fYear :
1996
Firstpage :
449
Lastpage :
451
Abstract :
The DC and RF performance of a 0.25 μm gate-length p-type SiGe modulation-doped field-effect transistor (MODFET) is reported. The hole channel consists of compressively strained Si/sub 0.3/Ge/sub 0.7/ layer grown on a relaxed Si/sub 0.7/Ge/sub 0.3/ buffer on a Si substrate. The combination of high-hole mobility, low-gate leakage current, and improved ohmic contact metallization results in an enhancement of the DC and RF performance. A maximum extrinsic transconductance (g(m/sub e/xt)) of 230 mS/mm was measured. A unity current gain cut-off frequency (fT) of 24 GHz and a maximum frequency of oscillation (fmax) of 37 GHz were obtained for these devices.
Keywords :
Ge-Si alloys; characteristics measurement; high electron mobility transistors; hole mobility; leakage currents; ohmic contacts; semiconductor materials; 0.25 micron; 24 GHz; 37 GHz; MODFET; RF performance; Si; SiGe-Si; compressively strained layer; extrinsic transconductance; frequency of oscillation; gate leakage current; hole channel; hole mobility; modulation-doped field-effect transistor; ohmic contact metallization; unity current gain cut-off frequency; Cutoff frequency; Epitaxial layers; FETs; Germanium silicon alloys; HEMTs; Leakage current; MODFETs; Ohmic contacts; Radio frequency; Silicon germanium;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.536289
Filename :
536289
Link To Document :
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