• DocumentCode
    136709
  • Title

    Heat dissipating structure design of an inverter with direct-cooling IGBT module for EV

  • Author

    Sun Wei ; Liu Jun ; Su Wei ; Gong Xuegeng

  • Author_Institution
    Key Lab. of Power Electron. & Electr. Drive, Inst. of Electr. Eng., Beijing, China
  • fYear
    2014
  • fDate
    Aug. 31 2014-Sept. 3 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, we tested the heat dissipating performance of a self-developed 2 in 1 direct cooling IGBT module and contrasted with the traditional indirect cooling module, and a simulation model for the module was verified accurate. The experiment results show that entire thermal resistance of the direct cooling module is reduced up to 33%, meanwhile the temperature field distribution is more uniform. Then we conducted the heat dissipation structure design for a high power density inverter, and got a satisfactory result using the simulation model. At last, we tested the thermal resistance of direct cooling IGBT module in the inverter.
  • Keywords
    cooling; electric vehicles; insulated gate bipolar transistors; invertors; modules; power bipolar transistors; power field effect transistors; direct cooling IGBT module; direct cooling module; electric vehicles; heat dissipating structure design; heat dissipation structure design; high power density inverter; thermal resistance; Cooling; Heating; Insulated gate bipolar transistors; Inverters; Multichip modules; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transportation Electrification Asia-Pacific (ITEC Asia-Pacific), 2014 IEEE Conference and Expo
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-4240-4
  • Type

    conf

  • DOI
    10.1109/ITEC-AP.2014.6940980
  • Filename
    6940980