Title :
The inverted T-joint for surface mount connectors
Author :
Yamada, Shoji E. ; Watanabe, Yosinori
Author_Institution :
Molex Japan Inc., Tokyo, Japan
fDate :
6/1/1990 12:00:00 AM
Abstract :
The stresses in inverted T-shaped surface mounted solder joints are computed by means of a beam-on-elastoplastic-foundation model. The stress in the inverted T-shaped joint is shown to be distributed more evenly than in the L-shaped joint, and hence, the inverted T-shaped joint gives a much higher vertical pull strength than the L-shaped (gull wing) lead. Pull tests experiments on these two types of joints support the analytical result. It is shown that a simple pull test can give an erroneous strength indication if rotation at the loading point is permitted
Keywords :
electric connectors; soldering; surface mount technology; T-shaped joint; beam-on-elastoplastic-foundation model; inverted T-joint; loading point; rotation; solder joints; strength indication; stresses; surface mount connectors; vertical pull strength; Connectors; Equations; Finite element methods; Lead; Reliability theory; Shape; Soldering; Stress; Surface-mount technology; Testing;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on