• DocumentCode
    136743
  • Title

    High-fundamental-frequency modulation for the DC-DC modular multilevel converter (MMC) with low switching frequency and predicted-based voltage balance strategy

  • Author

    Yu Chen ; Yuqing Cui ; Yupu Tao ; Yong Kang ; Xiaoguang Wei ; Xinying Wang

  • Author_Institution
    State Key Lab. of Adv. Electromagn. Eng. & Technol., Huazhong Univ. of Sci. & Technol. (HUST), Wuhan, China
  • fYear
    2014
  • fDate
    Aug. 31 2014-Sept. 3 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This paper proposes the high-fundamental-frequency modulation of the dc-dc MMC-transformer-MMC topology, which is a potential candidate for the HVDC and transportation applications. With the proposed modulation, the MMC arms generate a high-fundamental-frequency ac voltage applying on the transformer, the size of the transformer, as well as the inductors and capacitors of the MMC arms, can be reduced. On the other hand, the proposed modulation ensures all the MMC submodules strictly working at the same fundamental frequency, and the switching losses of all the submodules are approximately balanced. Besides, the capacitor voltage balance strategy under the proposed modulation strategy is presented, and the current stresses of the submodules are also analyzed. Finally, the proposed modulation method is verified by a 10 kV/20 kV/1 MW simulation.
  • Keywords
    DC-DC power convertors; HVDC power convertors; frequency modulation; power transformers; switching convertors; DC-DC MMC-transformer; DC-DC modular multilevel converter; HVDC; MMC submodules; MMC topology; capacitor voltage balance strategy; high-fundamental-frequency modulation; low switching frequency; power 1 MW; predicted-based voltage balance strategy; voltage 10 kV; voltage 20 kV; Capacitors; Modulation; Sorting; Stress; Switches; Switching frequency; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transportation Electrification Asia-Pacific (ITEC Asia-Pacific), 2014 IEEE Conference and Expo
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-4240-4
  • Type

    conf

  • DOI
    10.1109/ITEC-AP.2014.6941015
  • Filename
    6941015