DocumentCode :
136760
Title :
Si and SiC power MOSFET characterization and comparison
Author :
Feng Qi ; Lixing Fu ; Longya Xu ; Ping Jing ; Guoliang Zhao ; Jiangbo Wang
Author_Institution :
Ohio State Univ., Columbus, OH, USA
fYear :
2014
fDate :
Aug. 31 2014-Sept. 3 2014
Firstpage :
1
Lastpage :
6
Abstract :
This paper characterizes and compares Si and SiC power MOSFETs in high temperature conditions. The superior advantages of SiC power device, including conductivity, breakdown voltage, high switching speed and high temperature operating potentials, are discussed based on the semiconductor physics properties, including bandgap energy, critical electric field, saturation velocity and thermal conductivity. In characterization of the power devices, the device threshold voltage, on-resistance and leakage current are measured and compared at different temperature levels. The operating characteristics variations are investigated to reveal the high temperature effects on the devices. A DC-DC boost converter with high temperature capability is built and tested in a thermal chamber at 150 °C. The testing results are used to demonstrate the potentials of SiC based power converter in high temperature conditions.
Keywords :
DC-DC power convertors; circuit switching; electric current measurement; electric fields; leakage currents; power MOSFET; semiconductor device testing; silicon compounds; thermal analysis; thermal conductivity; voltage measurement; wide band gap semiconductors; DC-DC boost converter; Si; SiC; bandgap energy; breakdown voltage; device threshold voltage; electric field; leakage current; power MOSFET characterization; power converter; power device; saturation velocity; semiconductor physics properties; switching speed; thermal chamber; thermal conductivity; Conductivity; MOSFET; Silicon; Silicon carbide; Temperature; Temperature measurement; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Transportation Electrification Asia-Pacific (ITEC Asia-Pacific), 2014 IEEE Conference and Expo
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-4240-4
Type :
conf
DOI :
10.1109/ITEC-AP.2014.6941032
Filename :
6941032
Link To Document :
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