Title :
An Efficient 1-D Periodic Boundary Integral Equation Technique to Analyze Radiation onto Straight and Meandering Microstrip Lines
Author :
Vande Ginste, Dries ; Rogier, Hendrik ; De Zutter, Daniël
fDate :
6/1/2012 12:00:00 AM
Abstract :
A modeling technique to analyze the radiation onto arbitrary 1-D periodic metallizations residing on a microstrip substrate is presented. In particular, straight and meandering lines are being studied. The method is based on a boundary integral equation, more specifically on a mixed potential integral equation (MPIE), that is solved by means of the method of moments. A plane wave excites the microstrip structure, and according to the Floquet-Bloch theorem, the analysis can be restricted to one single unit cell. Thereto, the MPIE must be constructed using the pertinent 1-D periodic layered medium Green´s functions. Here, these Green´s functions are obtained in closed form by invoking the perfectly matched layer paradigm. The proposed method is applied to assess the radiation onto 1) a semi-infinite plate, 2) a straight microstrip line, and 3) a serpentine delay line. These three types of examples clearly illustrate and validate the method. Also, its efficiency, compared to a previously developed fast microstrip analysis technique, is demonstrated.
Keywords :
Green´s function methods; integral equations; method of lines; microstrip lines; periodic structures; 1D periodic boundary integral equation; 1D periodic layered medium Green functions; Floquet-Bloch theorem; MPIE; meandering microstrip lines; method of moments; microstrip substrate; mixed potential integral equation; perfectly matched layer; serpentine delay; straight microstrip lines; Current density; Green´s function methods; Metallization; Microstrip; Moment methods; Periodic structures; Substrates; Electromagnetic radiation; Green’s function; integral equation; meandering lines; method of moments (MoM); microstrip structure; perfectly matched layer (PML); periodic structure;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2011.2171491