DocumentCode
1367905
Title
Design issues and insights for low-voltage high-density SOI DRAM
Author
Fossum, Jerry G. ; Chiang, Meng-Hsueh ; Houston, Theodore W.
Author_Institution
Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
Volume
45
Issue
5
fYear
1998
fDate
5/1/1998 12:00:00 AM
Firstpage
1055
Lastpage
1062
Abstract
A physics-based study of floating-body effects on the operation of SOI DRAM is described. The study, which is based on device and circuit simulations using a physical SOI MOSFET model calibrated to an actual partially-depleted (PD) SOI DRAM technology, addresses the performance of the peripheral circuitry, e.g., the sense amplifier, as well as the dynamic retention of the data storage cell. Design insight for low-voltage high-density SOI DRAM is attained. Double cell design is shown to yield a dynamic retention time long enough for gigabit memories, and crude body-source ties for nMOS, with pMOS bodies floating, are shown to effectively suppress instabilities in the sense amplifier
Keywords
CMOS memory circuits; DRAM chips; circuit stability; integrated circuit design; integrated circuit modelling; silicon-on-insulator; LV high-density SOI DRAM; Si; circuit simulations; data storage cell; device simulations; double cell design; dynamic RAM design issues; dynamic retention; floating-body effects; gigabit memories; low-voltage operation; partially-depleted SOI technology; peripheral circuitry; physical SOI MOSFET model; sense amplifier; CMOS digital integrated circuits; Circuit simulation; Coupling circuits; Immune system; Integrated circuit synthesis; Integrated circuit yield; MOS devices; MOSFET circuits; Random access memory; Silicon on insulator technology;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.669528
Filename
669528
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