• DocumentCode
    1367905
  • Title

    Design issues and insights for low-voltage high-density SOI DRAM

  • Author

    Fossum, Jerry G. ; Chiang, Meng-Hsueh ; Houston, Theodore W.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
  • Volume
    45
  • Issue
    5
  • fYear
    1998
  • fDate
    5/1/1998 12:00:00 AM
  • Firstpage
    1055
  • Lastpage
    1062
  • Abstract
    A physics-based study of floating-body effects on the operation of SOI DRAM is described. The study, which is based on device and circuit simulations using a physical SOI MOSFET model calibrated to an actual partially-depleted (PD) SOI DRAM technology, addresses the performance of the peripheral circuitry, e.g., the sense amplifier, as well as the dynamic retention of the data storage cell. Design insight for low-voltage high-density SOI DRAM is attained. Double cell design is shown to yield a dynamic retention time long enough for gigabit memories, and crude body-source ties for nMOS, with pMOS bodies floating, are shown to effectively suppress instabilities in the sense amplifier
  • Keywords
    CMOS memory circuits; DRAM chips; circuit stability; integrated circuit design; integrated circuit modelling; silicon-on-insulator; LV high-density SOI DRAM; Si; circuit simulations; data storage cell; device simulations; double cell design; dynamic RAM design issues; dynamic retention; floating-body effects; gigabit memories; low-voltage operation; partially-depleted SOI technology; peripheral circuitry; physical SOI MOSFET model; sense amplifier; CMOS digital integrated circuits; Circuit simulation; Coupling circuits; Immune system; Integrated circuit synthesis; Integrated circuit yield; MOS devices; MOSFET circuits; Random access memory; Silicon on insulator technology;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.669528
  • Filename
    669528